| 图片 | 型号 | 制造商 | 描述 | 参考价格 | 库存数量 | 询价 |
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散热片 4 FINS, 2.000 OD HS W/4 LEGS 25MM CLIP
PDF数据手册
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暂无价格
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参考库存:32898
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散热片 maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 32.5x32.5x19.5mm, 57.4mm Fin Tip
PDF数据手册
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暂无价格
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参考库存:32895
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散热片 Board Level Stamped Heatsink for TO-220, Vertical Mounting, 19.05x50.8x41.15mm, Tab Fold
PDF数据手册
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暂无价格
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参考库存:32892
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散热片 7 FINS, 2.000 OD HS W/3 LEGS 27MM CLIP
PDF数据手册
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暂无价格
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参考库存:32889
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散热片 Spare 1U Heat sink 78mmx108mm 39 fins for 1U Chassis
PDF数据手册
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暂无价格
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参考库存:32886
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散热片 Heatsink Fan Combination, 50x50mm, 5.9CFM, 39.5mm Height, 0.67 C/W
PDF数据手册
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1:¥286.9974 10:¥270.635 25:¥254.4195 50:¥238.204
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参考库存:32883
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散热片 MULTI-DIR HEAT SINK FOR nanoX-TC
PDF数据手册
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暂无价格
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参考库存:32880
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暂无价格
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参考库存:32877
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散热片 Chipset Heatsink with Clip, Pin Fin, 33mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
PDF数据手册
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暂无价格
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参考库存:32874
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散热片 Thin-Fin Board Level Stamped Heatsink for PCI/AGP Chip Sets, Thin Fin, Copper, Horizontal/Vertical Mounting, 25.4x76.2x0.33mm
PDF数据手册
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3,000:¥21.0519
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参考库存:32871
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散热片 Chipset Heatsink with Clip, Pin Fin, 29mm Chip Size, 14.6mm Height, Aluminum, Black Anodized
PDF数据手册
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暂无价格
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参考库存:32868
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散热片 Chipset Heatsink with Clip, Pin Fin, 23mm Chip Size, 20.6mm Height, Aluminum, Black Anodized
PDF数据手册
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暂无价格
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参考库存:32865
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散热片 CEM860 Cooling Kit for Core-i Processors for Max. up to 45 Watt Core-i CPU
PDF数据手册
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暂无价格
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参考库存:32862
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散热片 Extrusion, 8 Foot Bar, Unfinished
PDF数据手册
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暂无价格
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参考库存:32859
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散热片 Self-Locking Wave-Solderable Heatsink for TO-220, Aluminum, Black Anodized, 14.5x12.7x18.4mm, Vertical, 10 Tab
PDF数据手册
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暂无价格
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参考库存:32856
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散热片 Heatsink for TO-220, with Clip
PDF数据手册
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暂无价格
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参考库存:32853
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散热片 Heatsink for TO-220, Dielectric Tabs, 13 Degree C/W Thermal Resistance
PDF数据手册
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暂无价格
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参考库存:32850
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散热片 Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, 6.4mm Height, Chomerics T411
PDF数据手册
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暂无价格
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参考库存:32847
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散热片 Heatsink for Metal/Ceramic BGA Packages, Black Anodized, 35x35x25mm, IC Pkg Size = 35 x 35, Tape #32
PDF数据手册
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暂无价格
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参考库存:32844
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暂无价格
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参考库存:32841
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