| 图片 | 型号 | 制造商 | 描述 | 参考价格 | 库存数量 | 询价 |
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散热片 BGA Heatsink, 27x21mm, Diagonal Plastic Push Pin
PDF数据手册
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暂无价格
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参考库存:33018
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散热片 High performance heatsink with fan Express-BE with threaded standoffs for bottom mounting
PDF数据手册
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暂无价格
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参考库存:33015
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散热片 3 FINS2.000 OD HS W/4 LEGS30.5MM CLIP
PDF数据手册
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暂无价格
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参考库存:33012
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散热片 maxiFLOW Heatsink with maxiGRIP Attachment, Double-Sided Thermal Tape, Blue-Anodized, T412, 40x40x7.5mm
PDF数据手册
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暂无价格
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参考库存:33009
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散热片 Slide-On Style Stamped Heatsink for TO-220, Low-Cost, Labor Saving, Spring Action, Vertical Mounting, 16 n Thermal Resistance, 1.91mm Hole, 35.05mm, Solderable Tabs
PDF数据手册
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暂无价格
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参考库存:33006
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暂无价格
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参考库存:33003
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暂无价格
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参考库存:33000
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散热片 4 FINS 1.375 OD HS W/4 LEGS 45mm CLIP
PDF数据手册
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暂无价格
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参考库存:32997
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散热片 HEATSPREADER FOR Express-ATR
PDF数据手册
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暂无价格
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参考库存:32994
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散热片 Board Level Extruded Heatsink for TO-220, Vertical Mounting, PC Pin, Black Anodized, 25.4x34.93x12.70mm
PDF数据手册
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暂无价格
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参考库存:32991
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散热片 LOW PROF HEAT SINK FOR Express-NR
PDF数据手册
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暂无价格
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参考库存:32988
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散热片 Chipset Heatsink with Clip, Pin Fin, 21mm Chip Size, 14.6mm Height, Aluminum, Black Anodized
PDF数据手册
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暂无价格
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参考库存:32985
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散热片 maxiFLOW superGRIP Heatsink Assembly, Low Profile, T766, Black-Anodized, 30.25x30.25x14.5mm
PDF数据手册
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100:¥108.3444
500:¥98.6603
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参考库存:32982
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散热片 Heatsink with fins for COMe/ETX/XTX
PDF数据手册
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1:¥329.2594
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参考库存:32979
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散热片 Standard heatspreader for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
PDF数据手册
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暂无价格
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参考库存:32976
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散热片 BGA Cooling Solutions with superGRIP Attachment, High Performance, 37.5x37.5x17.5mm
PDF数据手册
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1:¥142.6173
10:¥134.7751
50:¥118.876
100:¥110.9547
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参考库存:32973
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暂无价格
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参考库存:32970
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散热片 High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 182.88x152.4mm
PDF数据手册
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暂无价格
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参考库存:32967
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散热片 superGRIP Heatsink Assembly, Straight Fin, Low Profile, T766, Black-Anodized, 41.75x41.75x19.5mm
PDF数据手册
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100:¥117.6443
500:¥107.1918
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参考库存:32964
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散热片 Semiconductor Mounting Pad for TO-5, DAP, 3 Leads, Diameter 8.71mm
PDF数据手册
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暂无价格
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参考库存:32961
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