| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
|
|
|
|
散热片
|
|
散热片 Low-Height Double-Surface Heatsink for TO-3 Case Styles and Diodes, 120.7x76.2x47.6mm, (1) TO-3 Mounting Hole Pattern
|
暂无价格
|
参考库存:30046
|
|
|
|
|
散热片
|
|
散热片 Standard heatspreader for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
|
暂无价格
|
参考库存:30049
|
|
|
|
|
散热片
|
|
散热片 HEATSINK ASSEMBLY 27MM
|
暂无价格
|
参考库存:30052
|
|
|
|
|
散热片
|
|
散热片 maxiFLOW BGA Heatsink with maxiGRIP Attachment, High Performance, 42.5x42.5x12.5mm
|
100:¥72.2296
300:¥67.0768
500:¥65.7773
1,000:¥64.4665
|
参考库存:30055
|
|
|
|
|
散热片
|
|
散热片 BGA Cooling Solutions with superGRIP Attachment, High Performance, 25x25x7.5mm
|
1:¥113.0339
10:¥106.7285
50:¥94.2081
100:¥87.9027
|
参考库存:30058
|