| 图片 | 型号 | 描述 | 参考价格 | 库存数量 | 询价 |
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CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are M2.5mm thread.
PDF数据手册
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暂无价格
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参考库存:14088
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CPU与芯片冷却器 Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
PDF数据手册
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暂无价格
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参考库存:14073
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Type 7 module conga-TSXD with integrated heat pipes, 70mm radial 12V PWM fan and 30mm overall heat sink height. All standoffs are with 2.7mm bore hole.
PDF数据手册
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暂无价格
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参考库存:13836
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP higher than 17W * VC = Vapo
PDF数据手册
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暂无价格
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参考库存:13818
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CPU与芯片冷却器 Passive cooling solution for conga-IA5 based on open silicon Pentium and Celeron processors with 12mm heatsink fins.
PDF数据手册
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暂无价格
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参考库存:13797
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CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * T = M2.5 Thread
PDF数据手册
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暂无价格
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参考库存:13746
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CPU与芯片冷却器 Passive cooling solution for conga-PA5 based on open silicon Pentium and Celeron processors and heat sink with 12mm heatsink fins. All standoffs are with 2.7 mm threaded hole.
PDF数据手册
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暂无价格
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参考库存:13635
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Type 7 module conga-TSXD with integrated heat pipes, 70mm radial 12V PWM fan and 30mm overall heat sink height. All standoffs are M2.5mm thread.
PDF数据手册
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暂无价格
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参考库存:13551
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CPU与芯片冷却器 Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * B = Bore hole standoffs
PDF数据手册
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暂无价格
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参考库存:13515
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
PDF数据手册
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暂无价格
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参考库存:13467
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan.Intended for modules with TDP higher than 17W * VC = vapor
PDF数据手册
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暂无价格
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参考库存:13365
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
PDF数据手册
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暂无价格
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参考库存:13158
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
PDF数据手册
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暂无价格
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参考库存:13137
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