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散热片：151 条相关产品
图片型号描述参考价格库存数量询价
CONGA-B7AC/HSP-VC-T
散热片 Standard heatspreader for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber. Intended for modules with TDP higher than 17W *VC = Vapor Chamber *T = M2.5 threaded stand-offs PDF数据手册
暂无价格
参考库存:27838
CONGA-MA5/CSP-T
散热片 Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. PDF数据手册
暂无价格
参考库存:27814
CONGA-XAF/EAF/CSP-B
散热片 Standard passive cooling solution for XTX module conga-XAF and ETX module conga-EAF, orange surface with 10mm fins and borehole standoffs. PDF数据手册
暂无价格
参考库存:27811
CONGA-QA3/CSP-T
散热片 Standard heatspreader for Qseven module conga-QA3. All standoffs are M2.5mm threaded. PDF数据手册
暂无价格
参考库存:27802
CONGA-SA5/I-HSP-B
散热片 Standard heatspreader for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. PDF数据手册
暂无价格
参考库存:27769
CONGA-MA5/CSP-B
散热片 Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. PDF数据手册
暂无价格
参考库存:27754
CONGA-QMX6/HSP2-T
散热片 STANDARD HEAT SPREADER QMX6 2MM PDF数据手册
暂无价格
参考库存:27736
CONGA-TR3/HSP-HP-B
散热片 Standard heatspreader for high performance COM Express module conga-TR3 with integrated heat pipes. All standoffs are with 2.7mm bore hole. PDF数据手册
暂无价格
参考库存:27712
CONGA-B7AC/HSP-CU-T
散热片 Standard heatspreader for COM Express Basic Type 7 module conga-B7AC with integrated copper plate. Intended for versions up to 17W TDP * Cu = Copper plate * T = M2.5 threaded standoffs PDF数据手册
暂无价格
参考库存:27700
647035
散热片 Passive cooling solution for COM Express module conga-TCA/CCA with 10mm fins. Fins rotated 45 degrees from standard. All standoffs are 2.7mm bore hole. PDF数据手册
暂无价格
参考库存:27619
CONGA-XAF/HSP-T
散热片 HEATSPREADER FOR EAF / XAF 2.5mm PDF数据手册
暂无价格
参考库存:27545
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