| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
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散热片
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散热片 maxiGRIP BGA Heatsink with Attachment, High Performance, Straight Fin, Low Profile, Double-Sided Thermal Tape, Black-Anodized, T412, 42.5x42.5x14.5mm
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暂无价格
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参考库存:33168
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散热片
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散热片 High profile heatsink for cExpress-HL with threaded standoffs for bottom mounting
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暂无价格
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参考库存:33171
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散热片
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散热片 maxiFLOW superGRIP Heatsink Assembly, Low Profile, T766, Black-Anodized, 22.25x22.25x19.5mm
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100:¥111.8813
500:¥101.8921
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参考库存:33174
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散热片
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散热片 maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 30x30x9.5mm, 43.2mm Fin Tip
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暂无价格
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参考库存:33177
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散热片
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散热片 Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
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暂无价格
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参考库存:33180
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