| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
|
|
|
|
散热片
|
|
散热片 Standard passive cooling solution for COM Express Type 10 module conga-MA30 with cooling fins. All stand-offs are with M2.5 thread.
|
暂无价格
|
参考库存:28102
|
|
|
|
|
散热片
|
|
散热片 Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole.
|
暂无价格
|
参考库存:28105
|
|
|
|
|
散热片
|
|
散热片 BGA Heatsink (High Aspect Ratio Ext.), Custom Pin Fin, 31x31x8mm
|
暂无价格
|
参考库存:28108
|
|
|
|
|
散热片
|
|
散热片 Semiconductor Mounting Pad for TO-5, DAP, 4 Leads, Diameter 8.89mm
|
暂无价格
|
参考库存:28111
|
|
|
|
|
散热片
|
|
散热片 Board Level Stamped Heatsink for TO-220, Horizontal Mounting, 9.02x21.84x17.53mm
|
暂无价格
|
参考库存:28114
|