| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
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散热片
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散热片 Standard passive cooling solution for COM Express modules conga-TCA/CCA with 3mm fins. All standoffs are with 2.7mm bore hole.
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暂无价格
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参考库存:29351
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散热片
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散热片 Semiconductor Mounting Pad for Integrated Circuits, Nylon, 10 Leads, 12.70mm OD, 6.99mm Thickness
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暂无价格
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参考库存:29354
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散热片
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散热片 Heat Sink, maxiFLOW, Double-Sided Thermal Tape, Black Anodized, T412, 30x30x9mm
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暂无价格
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参考库存:29357
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散热片
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散热片 maxiFLOW BGA Heatsink, Thermal Tape, Blue-Anodized, Saint-Gobain C675, 42.5x42.5x17.5mm
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暂无价格
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参考库存:29360
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散热片
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散热片 LOW PROF HEAT SINK FOR Express-LPC
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暂无价格
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参考库存:29363
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