| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
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散热片
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散热片 Heatspreader solution for conga-PA5 based on open silicon Pentium and Celeron processors . All standoffs are with 2.7 mm threaded hole.
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暂无价格
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参考库存:29768
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散热片
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散热片 Board Level Stamped Heatsink, Black Anodized
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暂无价格
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参考库存:29771
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散热片
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散热片 superGRIP Heatsink Assembly, Straight Fin, Low Profile, T766, Black-Anodized, 16.25x16.25x14.5mm
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100:¥95.2025
500:¥86.671
1,000:¥84.9873
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参考库存:29774
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散热片
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散热片 BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 28.25x28.25x24.5mm, 28.25mm dia.
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暂无价格
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参考库存:29777
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散热片
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散热片 Channel Style Stamped Heatsink for TO-218, Folded Back Fins, Vertical Mounting, 8.6 n Thermal Resistance, Black Anodized, Solderable Tabs
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暂无价格
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参考库存:29780
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